Power Supply in Package Chip Market
Global Power Supply in Package Chip Market Trend, Opportunity, and Forecast Analysis, 2024-2032
Global Power Supply in Package Chip Market is segmented by Type, Application, and by Region. KDMI analyst foresees market revenue to cross USD 2.7 Billion by 2032 by growing with a CAGR of 5.6% during 2024-2032.
Global Power Supply in Package Chip Market Highlights
The global power supply in package chip market is expected to cross a value of USD 2.7 billion by the end of 2032. The market was valued at USD 1.8 billion in 2023 and is expected to expand at a CAGR of 5.6% between 2024-2032.
- Over the mid-term, the growing adoption of miniaturized power modules is the primary factor anticipated to drive the global power supply in package chip market.
- The growing complexities associated with designing PSiP solutions for specific applications is a major factor to challenge the market growth.
- The North America power supply in package chip market is projected to dominate the global market.
Power Supply in Package Chip Market: Report Scope |
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Base Year |
2023 |
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Base Year Market Size |
USD 1.8 Billion |
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Forecast Year |
2024-2032 |
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Forecast Year Market Size |
USD 2.7 Billion |
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CAGR Value |
5.6% |
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Power Supply in Package Chip Market Key Trends/Major Growth Drivers |
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Restraint Factors |
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Power Supply in Package Chip Market Segmentation |
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Power Supply in Package Chip Market Key Players |
Intel Corporation, ASE Group, Amkor Technology, TDK Corporation, Panasonic, Bel Fuse Inc., Jiangsu Changjiang Electronics Technology, Texas Instruments Incorporated, ON Semiconductor Corporation, Victor Corporation, STMicroelectronics N.V., CUI Global, Inc., Infineon Technologies AG, ROHM Co., Ltd., Semtech Corporation, Analog Devices, Inc., and others. |
Global Power Supply in Package Chip Market Outlook
An integrated chip that combines power supply components within a single package for delivering power to electronic devices is known as a power supply in package (PSiP) chip. The major benefit associated with PSiP chip is that it does not require the use of discrete components, such as transformers, inductors, capacitors, and other power management elements, and integrates all of these components into a single package.
Our analysis for the global power supply in package chip market states that the market growth is expected on account of growing adoption of miniaturized power modules. With the growing demand for smaller and compact electronic devices, such as smartphones, wearables, and IoT devices, the need for miniaturized power supply solutions is on the rise. Power supply in a package chip (PSiP) chips allow semiconductor manufacturers to integrate power components in a compact form factor. Intel Corporation, ASE Group, and Amkor Technology are some of the significant parties in the global market for power supply in package chip.
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Global Power Supply in Package Chip Market Drivers – Analyst’s Observation
According to the analysts at KD Market Insights, some key growth drivers for the global power supply in package chip market are:
- Skyrocketing Adoption of IoT Devices: Globally, the demand for internet of things (IoT) devices is increasing rapidly. According to our analysis, the revenue generated from internet of things (IoT) worldwide is expected to touch USD 3370.5 billion by 2032, while the number of IoT connected devices is projected to reach 33.3 billion in the same year. With the increasing demand for IoT devices, the need for stringent size and power requirements in semiconductor chips is expected to increase, thereby driving the demand for PSiP.
- Ongoing Technological Advancements in the Semiconductor Industry: The semiconductor industry is going through a massive change, supported by the increasing research and development for developing new materials, design methodologies, and manufacturing processes. These advancements witnessed in semiconductor packaging that helps chip manufacturers to develop more sophisticated and high-performing PSiP solutions is therefore expected to create numerous opportunities for market growth in the coming years.
Which Probable Factors Could Hamper the Growing Power Supply in Package Chip Market Trend?
As per our KD Market Insights analysis, some of the challenges expected to limit the global market growth of power supply in package chip are:
- Complexities in Designing PSiP Solutions for Specific Applications: Developing PSiP solutions for specific applications can be very much complex as the customization process poses several challenges w.r.t. design complexity, testing, and validation. As a result, this also increases the overall cost of the end-product, thereby hampering its demand among price-sensitive customers.
- Concern for Lower Power Range: Power Supply in Package Chips are designed for specific power ranges. As a result, it has limitations in terms of its scalability and flexibility, especially for applications that require wider power range outputs of dynamic power profiles. Such a factor is hence expected to lower the adoption of PSiP chips, and in turn, hinder the market growth.
How is the Global Power Supply in Package Chip Market Segmented?
Our experts at KD Market Insights have segmented the global power supply in package chip market as:
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By Type |
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By Application |
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By Region |
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What are the Probable Factors Influencing the North America Power Supply in Package Chip Forecast?
The North America power supply in package chip market is majorly driven by the increasing proliferation of consumer electronics, wearables, and IoT devices in the region, which is raising the demand for smaller and more energy-efficient electronic devices. Besides this, the growing emphasis on energy efficiency and sustainability, along with the development of artificial intelligence (AI) chipsets, backed by the ongoing advancements in semiconductor manufacturing and packaging technologies in the region, are some of the add-on factors projected to boost the market growth in North America.
As per our analysts at KD Market Insights, the following five players lead the North America power supply in package chip market growth:
- Texas Instruments Incorporated
- ON Semiconductor Corporation
- Vicor Corporation
- Power Integrations, Inc.
- CUI Global, Inc.
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Key Countries to Watch for in North America Power Supply in Package Chip Market |
Key Insights |
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United States Power Supply in Package Chip Market to Register the Largest Regional Market Share |
USD 0.7 Billion |
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Canada Power Supply in Package Chip Market to Grow with the Highest CAGR During 2024-2032 |
5.9% |
Which Key Players Top the Global Power Supply in Package Chip Market Share?
As per our analysts at KD Market Insights, the competitive landscape of global power supply in package chip market facilitates our readers in identifying their closest competitors. The manufacturers who are associated with power supply in package chip market are raising their focus on expanding their presence, as well as their market share. The market has also been witnessing an upward movement in the number of collaborations between research institutions and key players, aimed at introducing advanced technologies and innovation of new products. Here is a list of the key players who top the global power supply in package chip market share:
- Intel Corporation
- ASE Group
- Amkor Technology
- TDK Corporation
- Panasonic Corporation
- Bel Fuse Inc.
- Jiangsu Changjiang Electronics Technology
- Texas Instruments Incorporated
- ON Semiconductor Corporation
- Victor Corporation
- STMicroelectronics N.V.
- CUI Global, Inc.
- Infineon Technologies AG
- ROHM Co., Ltd.
- Semtech Corporation
- Analog Devices, Inc.
What are the Recent Developments Observed in the Power Supply in Package Chip Market?
Over the years, the experts at KD Market Insights have been observing the recent developments associated with global power supply in package chip market trends. Our expert’s market forecast analysis has recorded the market players adopting plentiful of key strategies including new product launches, mergers & acquisitions, and collaborations.
For instance, Qualcomm Technologies, Inc. announced that it has signed an agreement deal with Apple Inc. for the supply of Snapdragon 5G Model-RF Systems for its smartphones that would be launched in 2024, 2025, and 2026.
Further, SK Hynix stated that it is investing USD 1 Billion in advanced chip packaging in South Korea.
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- Publication date: 12th March 2024
- Base year: 2022
- Forecast year: 2023-2033
- Format: PDF, PPT,Word,Excel
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